论文标题
阻碍表面缺陷介导的键合分子簇的表面扩散
Hindered surface diffusion of bonded molecular clusters mediated by surface defects
论文作者
论文摘要
通过表面辅助自组装的低维材料的设计需要更好地了解限制表面扩散的因素。我们揭示了底物表面缺陷如何阻碍使用型号CUPC/CU（111）系统在金属表面上亚单层吸附物的迁移率。沉积后退火键Cupc分子成室温下通常是流动的树枝状簇。 Cu（111）上的表面缺陷会产生能量屏障，以防止金属表面上的CUPC簇运动。这种现象是通过仅在缺陷之间的可用空间中显示出刚体扩散的小簇的运动来揭示的。当簇被缺陷充分包围时，它们就会完全固定在适当的位置并固定。
The design of low dimensional materials through surface assisted self-assembly requires a better understanding of the factors that limit and control surface diffusion. We reveal how substrate surface defects hinder the mobility of sub-monolayer organic adsorbates on a metal surface with the model CuPc/Cu(111) system. Post-deposition annealing bonds CuPc molecules into dendritelike clusters that are often mobile at room temperature. Surface defects on Cu(111) create energetic barriers that prevent CuPc cluster motion on the metal surface. This phenomenon was unveiled by the motion of small clusters that show rigid-body diffusion solely in the available space in between defects. When clusters are sufficiently surrounded by defects, they become completely pinned in place and become immobilized.
