论文标题
热扩散成像：平面内导热率测量较大温度范围内的薄膜
Heat Diffusion Imaging: In-Plane Thermal Conductivity Measurement of Thin Films in a Broad Temperature Range
论文作者
论文摘要
这项工作结合了热供应测量测量的热量散布方法的原理，以测量薄膜的平面内电导率，而无需膜悬架或多个温度计沉积。我们将这种混合技术称为热扩散成像。热素侵袭成像系统提供了整个膜表面的温度分布图。平面内电导率可以从温度衰减曲线中提取。通过将系统与低温恒温器耦合，我们能够测量有或没有周期性孔的硅薄膜样品，并与平面时间层域内域的热反射（TDTR）测量和文献数据进行比较。
This work combines the principles of the heat spreader method and imaging capability of the thermoreflectance measurements to measure the in-plane thermal conductivity of thin-films without the requirement of film suspension or multiple thermometer deposition. We refer to this hybrid technique as heat diffusion imaging. The thermoreflectance imaging system provides a temperature distribution map across the film surface. The in-plane thermal conductivity can be extracted from the temperature decay profile. By coupling the system with a cryostat, we were able to conduct measurements from 40 K to 400 K. Silicon thin film samples with and without periodic holes were measured and compared with in-plane time-domain thermoreflectance (TDTR) measurement and literature data as validation for heat diffusion imaging.
