论文标题
SN-3AG-0.5CU焊料中蠕变的原位研究
In-situ study of creep in Sn-3Ag-0.5Cu solder
论文作者
论文摘要
通过柱状微观结构的SN-3AG-0.5cu wt。样品的蠕变行为和微观结构演化已通过固态蠕变测试在298 k处的30 MPa下进行，这很重要，这很重要。这很重要。由于298 k在焊料系统内的298 k是高温和微观结构内的高温范围，并确认了范围的范围，其中涉及范围的范围。已经使用重复和自动前挡二极管和自动电子反向散射衍射成像观察到了样品。在变形过程中，随着应变的增加而观察到多边形和重结晶，并且与基质间机器计算的化合物接口附近的局部晶格旋转相关。重结晶的谷物与其父谷物具有双重或特殊的边界关系。这两种成像方法的组合显示了一种晶粒（从[100]）变形的一种晶粒（载荷方向，LD，10.4°）的变形小于邻居晶粒2（来自[110]的LD 18.8°），在应变局部区域具有滑移痕迹。在晶粒1中，（1-10）[001]被观察到滑移系统，在晶粒2，（1-10）[ - 1-11]/2和（110）[ - 111]/2滑移系统中。晶格方向梯度随着塑性应变的增加而建立，并且观察到与骨折的近乎断裂的重结晶。
The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt.% sample with a columnar microstructure have been investigated through in-situ creep testing under constant stress of 30 MPa at 298 K. This is important, as 298 K is high temperature within the solder system and in-situ observations of microstructure evolutions confirm the mechanisms involved in deformation and ultimately failure of the material. The sample has been observed in-situ using repeat and automatic forescatter diode and auto electron backscatter diffraction imaging. During deformation, polygonisation and recrystallisation are observed heterogeneously with increasing strain, and these correlate with local lattice rotations near matrix-intermetallic compound interfaces. Recrystallised grains have either twin or special boundary relationships to their parent grains. The combination of these two imaging methods reveal one grain (loading direction, LD, 10.4 ° from [100]) deforms less than the neighbour grain 2 (LD 18.8° from [110]), with slip traces in the strain localised regions. In grain 1, (1-10)[001] slip system are observed and in grain 2, (1-10)[-1-11]/2 and (110)[-111]/2 slip systems are observed. Lattice orientation gradients build up with increasing plastic strain and near fracture recrystallisation is observed concurrent with fracture.
