论文标题
由不同的Xe+离子能诱导的TiO2/SiO2混合层的变化
Variation of TiO2/SiO2 mixed layers induced by different Xe+ ion energies
论文作者
论文摘要
使用Rutherford的反向散射光谱法(RB)和椭圆形度光谱法(ES)方法研究了TIO2/SIO2过渡层的扩展和光学参数。 TIO2/SIO2样品被XE+离子辐照,其能量为100、150、200和250 KEV。由RBS光谱确定的元素的深度谱图显示了植入前后TiO2/SiO2过渡层的结构和厚度。我们发现,随着入射离子能的增加,TIO2和SIO2层之间的过渡区域的厚度增加。这种现象表明在TIO2/SIO2界面处的原子混合量增加。另外,通过SRIM计算在混合层中传递的缺陷深度曲线和离子能量可以解释过渡层的变化。从RBS获得的厚度与使用ES方法测量的厚度非常吻合。基于这些获得的结果,我们还研究了植入和非植入TIO2/SIO2结构的光学常数。用不同的入射角测量的波形表明测量值接近主要原理点。 ψ和Δ带的产率在不同的入射角度变化,与所检查结构反射的光的干扰过程有关。发现植入后的折射率和灭绝系数增加了200击Xe,然后在250 keV处降低。
The broadening and optical parameters of TiO2/SiO2 transition layers depending on the ion energy have been investigated using the Rutherford Backscattering Spectrometry (RBS) and Ellipstrometry Spectroscopy (ES) methods. The TiO2/SiO2 samples were irradiated by Xe+ ions with energies of 100, 150, 200 and 250 keV. The depth profiles of the elements determined by the RBS spectra show the structure and thickness of the TiO2/SiO2 transition layers before and after implantation. We have found that the thickness of the transition region between the TiO2 and SiO2 layers increases with the increasing incident ion energy. This phenomenon indicates an increasing amount of atomic mixing at the TiO2/SiO2 interface. In addition, the variation of transition layers could be explained by defect depth profiles and ions energy transferred in the mixed layers by means of SRIM calculations. The thickness obtained from the RBS is in good agreement with that measured using the ES method. Based on these obtained results, we have also investigated the optical constants of implanted and non-implanted TiO2/SiO2 structures. The wave forms measured with varying incident angles suggest that the measurements were made close to near the main principle point. The yields of ψand δbands vary at different incident angles, is associated with interference processes of the light reflected from the structures examined. The refractive index and the extinction coefficient were found to increase after implantation taking place up to 200-keV Xe and then decrease at 250 keV.