论文标题
SN-3AG-0.5CU的多尺度可塑性均匀化：从β-SN微柱到具有金属间的多晶
Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics
论文作者
论文摘要
$β$ -SN单晶的机械性能已使用微乳房测试和速率依赖性晶体可塑性建模的组合方法进行了系统的研究。已经确定了$β$ -SN单晶内几个关键滑移系统的滑动强度和速率灵敏度。已经显示了针对支柱的数值预测和实验观察到的滑移痕迹之间的一致性，以激活单个和双滑。随后，通过多尺度均质化方法以及预测的温度和速率敏感性独立实验结果，预测了多晶$β$ -SN富合金SAC305（96.5SN-3AG-0.5CU WT％）的多晶$β$ -SN富合金SAC305（96.5SN-3AG-0.5CU WT％）的依赖温度依赖的，金属间尺寸的行为。集成的实验和数值方法提供了受热机械载荷（包括热疲劳）的电子焊料对微结构敏感行为的机械理解和基本材料特性。
The mechanical properties of $β$-Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity modelling. The slip strength and rate sensitivity of several key slip systems within $β$-Sn single crystals have been determined. Consistency between the numerically predicted and experimentally observed slip traces has been shown for pillars oriented to activate single and double slip. Subsequently, the temperature-dependent, intermetallic-size-governing behaviour of a polycrystal $β$-Sn-rich alloy SAC305 (96.5Sn-3Ag-0.5Cu wt%) is predicted through a multi-scale homogenization approach, and the predicted temperature- and rate-sensitivity reproduce independent experimental results. The integrated experimental and numerical approaches provide mechanistic understanding and fundamental material properties of microstructure-sensitive behaviour of electronic solders subject to thermomechanical loading, including thermal fatigue.
